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 EVG Model # EVG 101 Advanced Spray Coating System

Advanced Spray Coating System Semi-automatic, with manual loading, for wafer sizes up to 200mm. Tooled for 100-150mm wafers. Base frame for one resist processing module incl. all electronics, pneumatics, tubing for solvents (if applicable) and drain, exhaust lines. Manual wafer loading/ unloading, mechanical pre-alignment via Teflon pins; Pneumatically actuated pre-aligner, manually interchangeable for different wafer sizes. Self diagnostics and initialization during start up. Software: PC controlled recipe programming, password protected access levels for operator, engineer and maintenance, MS-Windows based graphical user interface (GUI). See attached pdf file for technical specifications.

EVG®101 Advanced Resist Processing SystemSingle wafer processing in R&D and small scale production.The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems. The EVG101 can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG's advanced OmniSpray® coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options. Features Automated spin or spray coating or developing with manual wafer load/unload. Easy process transfer from research to production utilizing proven modular design. Syringe dispense system for utilization of small resist volumes, including high viscosity resists. Small footprint while maintaining a high level of personal and process safety. Options:- Uniform coating of high topography wafer surfaces with OmniSpray® coating technology- Wax and Epoxy coating for subsequent bonding processes- Spin-On-Glass (SOG) coating.

 
Semi-automatic, with manual loading, for wafer sizes up to 200mm
Tooled for 100-150mm wafers
Basic Unit for One Coat Module  
 
  • Base frame for one resist processing module incl. all electronics, pneumatics, tubing of solvents (if applicable) and drain, exhaust lines.
  • Manual wafer loading/unloading, mechanical pre-alignment via Teflon® pins; pneumatically actuated pre-aligner, manually interchangeable for different wafer sizes.
  • Self diagnostics and initialization during start up Software.
  • PC-controlled recipe programming.
  • Password protected access levels for operator, engineer and maintenance.
  • MS-Windows® based graphical user interface (GUI)
External Tray for up to 2 Chemicals
 
  • Second containment and spill sensor.
  • Any combinations of tanks or resist dispense systems (Capacity for either two tanks or two resist dispense systems or one of each).
Solvent Tank
 
  • Stainless steel tank with load cell mount to be stored in external tray or chemistry cabinet.
  • Including valves for pressurizing.
Coat Module for Spin Coating  
 
  • Can be tooled for 100-200mm with back side rinse (BSR) feature.
  • Can be tooled additionally for pieces – 3” wafers without back side rinse (BSR) feature.
  • Z-left for spinner chuck for easy loading and unloading.
  • PTFE spinner chamber.
  • Programmable drive unit for up to 10000 rpm (max. rpm in process depends on actual configuration and substrate parameters).
  • Drain tank with filling level sensor at machine back side.
  • Exhaust flow interlocked and displayed (Magnehelic).
  • Fully software controlled center, edge and area dispense modes.
  • Dummy dispense and park position.
  • Pre-aligner paddle and adjustment tools.
Spray Coating Atomizer  
 
  • Ultrasonic Atomizer Nozzle for spray coating.
  • Separate Dispense Arm fir Spray Nozzle.
  • Conformal high topography substrate coating.
  • Maximum resist and polymer savings.
Cover for Coat Module  
 
  • For one coat module.
  • For best uniformity with high viscosity resist.
  • Automatically operated chamber cover.
  • Software for fully programmable cover position in process.
  • With 6 integrated nozzles for bowl wash.
Top Side Edge Bead Removal (EBR) System  
 
  • For one coat module.
  • For up to 150mm wafers.
  • Solvent nozzle is mounted on programmable dispense arm.
  • Software for fully programmable EBR process.
  • Solvent is dispensed via pressurized bowl wash tank (separate EBR tank optional).
Back Side Rinse (BSR) System for 150mm Wafers
 
  • Nozzle in chamber inserts.
  • For bottom side EBR.
  • Software for fully programmable back side rinse process.
  • Solvent is dispensed via pressurized tank as listed in basic unit (separate EBR tank optional).
  • For one Coat module.
Syringe Dispense System
 
  • For universal resists applications.
  • Dispense system without dead volume.
  • Especially for low volume production, expensive resist types resist with short shelf lifetime.
  • Programmable dispense rate.
  • Adjustable such back.
  • For all kinds of resists and polymers.
  • Resist type to be specified by customer.
  • Optional Syringe filter available.
Spinner Chuck for 150mm – 200mm Wafer
 
  • Vacuum handling from bottom site.
  • Supports standard wafer thickness from 0.3mm – 1mm (>0.3mm for 150mm, >0.4mm for 200mm)
  • Quick exchange design without screws.
  • 10µm lapped wafer contact surface.
Pre-aligner Paddle for 150 – 200mm Wafers
 
  • To be used with interchangeable automatic pre-aligner.
  • Chucks for adjusting paddle.